An analytical simulation model for VCSELs to support signal integrity analysis of optical interconnects

被引:0
|
作者
Clarici, Georg [1 ]
Griese, Elmar [1 ]
机构
[1] Univ Siegen, Inst Theoret Elect Engn & Photon, Hoelderlinstr 3, D-57068 Siegen, Germany
关键词
optical interconnects; signal integrity; VCSEL; IBIS;
D O I
10.1117/12.661940
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
The design of hybrid electro-optical systems needs to address the issue of signal integrity. In the area of electrical interconnects the input/output buffer information specification was introduced. To define a similar specification for optical interconnects an analytical model for vertical cavity surface emitting lasers is developed. It is based on the known solution of the Lotka-Volterra differential equations, which are related to the rate equations describing the behavior of lasers. The parameters of this analytical model directly describe the dynamic behavior of vertical cavity surface emitting lasers and they share many features with the input/output buffer information specification as they can be provided in a tabulated form and are partly accessible to measurement.
引用
收藏
页数:11
相关论文
共 50 条
  • [41] Statistical Signal Integrity Analysis on DFE with Nonideal Latch Model
    Park, Junyong
    ELECTRONICS, 2025, 14 (01):
  • [42] A coupled efficient and systematic full-wave time-domain macromodeling and circuit simulation method for signal integrity analysis of high-speed interconnects
    Li, EP
    Liu, EX
    Li, LW
    Leong, MS
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2004, 27 (01): : 213 - 223
  • [43] Analytical Model for Optical Wireless OFDM System with Digital Signal Restoration
    Vanin, Evgeny
    2012 IEEE GLOBECOM WORKSHOPS (GC WKSHPS), 2012, : 1213 - 1218
  • [44] Performance Analysis of Vertical and Horizontal Transmitter Array Modules Using Short- and Long-Wavelength VCSELS for Optical Interconnects
    Ukaegbu, Ikechi Augustine
    Kim, Do-Won
    Shirazy, Mohammed Shorab Muslim
    Lee, Tae-Woo
    Cho, Mu Hee
    Park, Hyo-Hoon
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2013, 3 (05): : 740 - 748
  • [45] Signal Integrity Analysis of Silicon/Glass/Organic Interposers for 2.5D/3D Interconnects
    Choi, Sumin
    Park, Junyong
    Jung, Daniel H.
    Kim, Joungho
    Kim, Heegon
    Kim, Kiyeong
    2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 2139 - 2144
  • [46] Simulation Models for Signal Integrity Analyses Extracted from Computed Tomography Scans - A Case Study for High-Speed Interconnects
    Simon, Sven
    Hillebrand, Juergen
    Kiess, Steffen
    2014 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2014, : 973 - 978
  • [47] A modified IBIS model aimed at signal integrity analysis of systems in package
    Pulici, Paolo
    Girardi, Antonio
    Vanalli, Gian Pietro
    Izzi, Roberto
    Bernardi, Giacomo
    Ripamonti, Giancarlo
    Strollo, Antonio G. M.
    Campardo, Giovanni
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2008, 55 (07) : 1921 - 1928
  • [48] Analysis of simulation model for acoustic signal based on AR model
    Xiong, YJ
    Lou, WZ
    Wang, CS
    ISTM/2005: 6th International Symposium on Test and Measurement, Vols 1-9, Conference Proceedings, 2005, : 192 - 195
  • [49] IC Package with the system board Interconnects simulation showing PDN noise due to simultaneous switching IOs and its effect on Signal Integrity
    Jagadeesh, Rajesh Badala
    Ramashastry, Venkatesh
    Ramprasad, Bharath
    Srihari, Surya Prakash Rao Bengaluru
    Bhat, Satvik
    Radhakrishna, Vignesh Sunku
    2022 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS), 2022,
  • [50] Kron-Branin Modeling of Y-Y-Tree Interconnects for the PCB Signal Integrity Analysis416
    Ravelo, Blaise
    Maurice, Olivier
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2017, 59 (02) : 411 - 419