共 6 条
[1]
FU Y, 2000, IEEE T ADV PACKAGING, V23
[2]
LAI Z, 1996, IEEE T COMPON PACK B, V19, P664
[3]
McGovern L. P., 1998, Electronic Packaging and Production, V38, P68
[4]
Pascarella N. W., 1997, International Journal of Microcircuits and Electronic Packaging, V20, P571
[5]
TOOTOONCHI A, 2001, SMTA INT P OCT
[6]
WANG CP, 1997, IEEE 475 ECTC P SAN