The Use of Shape Memory Polymers for Microassembly by Transfer Printing

被引：50
作者：
Eisenhaure, Jeffrey D. [1 ]
Rhee, Sang Il [1 ]
Al-Okaily, Ala'a M. [1 ]
Carlson, Andrew [2 ]
Ferreira, Placid M. [1 ]
Kim, Seok [1 ]
机构：
[1] Univ Illinois, Dept Mech Sci & Engn, Urbana, IL 61801 USA
[2] Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
来源：
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | 2014年 / 23卷 / 05期
基金：
美国国家科学基金会;
关键词：
Shape memory polymer; microassembly; transfer printing; dry adhesives; reversible adhesion; ELASTOMERIC SURFACES; ADHESION; STAMP;
D O I：
10.1109/JMEMS.2014.2345274
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The advantages of utilizing the polymeric shape memory effect for deterministic assembly of microscale objects are explored in this letter. The assembly is performed by transfer printing, which involves a polymeric stamp with reversible adhesion as a manipulator. The dynamic rigidity control afforded by heating or cooling a shape memory polymer (SMP) stamp across its glass transition temperature allows for a dramatic increase in adhesion during pick-up. Furthermore, the shape-fixing and recovery property of the SMP material enables substantial freedom in stamp design, such as more complex surface patterning and heterogeneous surface features to further reduce adhesion during release not otherwise available. [2014-0158]
引用
收藏
页码：1012 / 1014
页数：3
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