A highly integrated 0.25um BiCMOS chipset for 3G UMTS/WCDMA handset RF sub-system

被引：11

作者：

Brunel, D ^{[1
]}

Caron, C ^{[1
]}

Cordier, C ^{[1
]}

Soudée, E ^{[1
]}

机构：

[1] Philips Semicond, F-14079 Caen 5, France

来源：

2002 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS | 2002年

关键词：

D O I：

10.1109/RFIC.2002.1012029

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The complete active portion of the 3G UMTS/WCDMA cellular handset RF sub-system is achieved with three RFICs. This chipset comprises a fully integrated ZIF Receiver including RF VCO/PLL and UMTS clock generation, a fully integrated direct conversion like Transmitter including RF VCO/PLL, and a 25dBm average Power Amplifier including power detection circuitry. The three RFICs use the same baseline 0.25um BiCMOS technology opening possibilities to even higher integration level. This chipset is targeted at handset class 3 and 4 (PA is class 4 compatible only) European and Japanese 3G UNITS and WCDMA standards.

引用

页码：191 / 194

页数：4