Comparison of SiGe and SiGe:C heterojunction bipolar transistors

被引:11
|
作者
Knoll, D [1 ]
Heinemann, B [1 ]
Ehwald, KE [1 ]
Tillack, B [1 ]
Schley, P [1 ]
Osten, HJ [1 ]
机构
[1] IHP, D-15236 Frankfurt, Germany
关键词
SiGe heterojunction bipolar transistors; transient enhanced B diffusion; carbon doping of SiGe; RF performance; device yield;
D O I
10.1016/S0040-6090(00)00866-X
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We compare the performance of heterojunction bipolar transistors with pure SiGe (SiGe HBTs) with those incorporating C-doped SiGe base layers (SiGe:C HBTs). The transistors were produced in a single-polysilicon technology with implanted, epi-free wells. Doping the SiGe layers with low C concentration (similar to 0.2%) allows us to use a higher base boron dose than for C-free HBTs, without B outdiffusion from the heteroepitaxial layer. As a result, the device RF performance can be significantly improved. The higher base doping of SiGe:C HBTs increases the peakf(max) from around 50 up to more than 80 GHz, and reduces the minimum noise figure (at 10 GHz) from >3 to 2 dB and ring oscillator delays from 21-22 to 12-14 ps. The SiGe:C HBTs also exhibit leakage currents, which are sufficiently low for reliable IC application. (C) 2000 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:342 / 346
页数:5
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