Analysis of interfacial fracture in ceramic-metal assemblies under effect of thermal residual stresses

被引：8

作者：

Drai, A. ^{[1
]}

Bouiadjra, B. Bachir ^{[1
]}

Meddah, M. ^{[2
]}

Benguediab, M. ^{[1
]}

机构：

[1] Univ Djillali Liabes Sidi Bel Abbes, LMPM, Dept Mech Engn, Sidi Bel Abbes 22000, Algeria

[2] Univ Mascara, Dept Mech Engn, Mascara 29000, Algeria

来源：

COMPUTATIONAL MATERIALS SCIENCE | 2009年 / 46卷 / 04期

关键词：

Interface cracks; Ceramic; Metal; SIF; Finite element method; FUNCTIONALLY GRADED MATERIALS; INTENSITY FACTORS; CRACK-GROWTH;

D O I：

10.1016/j.commatsci.2009.05.026

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this study, the finite element method is used to analyze the behavior of interface cracks in ceramic-metal assemblies under the effect of thermal residual stresses. These stresses are due to the elaboration process of the bimaterial junctions. The stress intensity factor is used as fracture criterion. The effects of the temperature of elaboration and the metal thickness on the variations of the thermal SIF are highlighted. The obtained results show that the mode of fracture under thermal residual stresses for ail ceramic-metal couples is the mixed mode (opening + sliding). The mode II (the sliding mode) is the dominant mode. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：1119 / 1123

页数：5