Graphene CVD: Interplay Between Growth and Etching on Morphology and Stacking by Hydrogen and Oxidizing Impurities

被引:66
作者
Choubak, Saman [1 ,2 ]
Levesque, Pierre L. [3 ,4 ]
Gaufres, Etienne [3 ,4 ]
Biron, Maxime [1 ,2 ]
Desjardins, Patrick [1 ,2 ]
Martel, Richard [3 ,4 ]
机构
[1] Polytech Montreal, RQMP, Montreal, PQ H3C 3A7, Canada
[2] Polytech Montreal, Dept Genie Phys, Montreal, PQ H3C 3A7, Canada
[3] Univ Montreal, RQMP, Montreal, PQ H3C 3J7, Canada
[4] Univ Montreal, Dept Chim, Montreal, PQ H3C 3J7, Canada
基金
加拿大自然科学与工程研究理事会;
关键词
CHEMICAL-VAPOR-DEPOSITION; COPPER; KINETICS; FILMS;
D O I
10.1021/jp5070215
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The growth of high quality graphene layers by chemical vapor deposition (CVD) has been found to strongly depend on growth conditions with results varying greatly from one laboratory to another for nominally identical conditions. We report the results of a systematic investigation of the role of hydrogen and oxidizing impurities present in the gas feedstock during the growth and cooling stages in low-pressure CVD. First, we show that for a partial pressure of oxidizing impurities below 1 ppb, hydrogen is not required for graphene growth from methane. Second, we demonstrate that purified hydrogen does not etch graphene films at typical growth temperatures. Third, a flow of purified hydrogen during cooling counterbalances graphene etching by oxygen, thus protecting the films. Films grown under high purity conditions (low level of oxidizing impurities) exhibit a higher bilayer and multilayer coverage; Surprisingly some of these bi- and multilayer graphene islands are twisted with respect to the first graphene layer as revealed by hyperspectral Raman imaging. Overall, this growth behavior suggests a competitive action between film growth from the carbon precursors and etching by the oxidative species. Our results provide new fundamental insights on the graphene CVD growth, highlighting the important yet indirect role of hydrogen and its major influence on controlling the action of oxidizing impurities on nucleation and etching during the growth process.
引用
收藏
页码:21532 / 21540
页数:9
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