Thermal stability of some naphthalene- and phenyl-based epoxy resins

被引:48
作者
Duann, YF
Liu, TM
Cheng, KC
Su, WF
机构
[1] Natl Taipei Univ Technol, Dept Chem Engn, Taipei 106, Taiwan
[2] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei, Taiwan
[3] Natl Taiwan Univ, Inst Polymer Sci & Engn, Taipei 10764, Taiwan
关键词
glass transition temperature (T-g); differential scanning calorimetry (DSC); thermogravimetric analysis (TGA); limited oxygen index (LOI) tester;
D O I
10.1016/j.polymdegradstab.2004.01.016
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Six epoxy monomers were synthesized and cured using 4,4'-methylenedianiline (DDM). The glass transition temperatures (T-g) of naphthalene- and phenyl-based epoxy resins were in the ranges 175-213 degreesC and 128-200 degreesC, respectively. Naphthalene-based epoxy resins 1,5-bis(2,3-epoxypropoxy)naphthalene (A) and 2,7-bis(2,3-epoxypropoxy)naphthalene (B) have almost equal LOIs, implying that the effects of the position of the substituent on LOI was very weak. 4,4'-Bis(2,3-epoxypropoxy)benzylideneaniline (D) has the lowest LOI. The same trend was exhibited when some of the epoxy monomers were cured using the curing agent, sulfanilamide (SAA). The order of the LOIs of the epoxy resins was (B) = (F) > (A) > (E) > (C) > (D), when cured using 4,4'-methylenedianiline (DDM). Degradation proceeds in a single stage in an atmosphere of nitrogen and in two stages in air. At 800 degreesC, the epoxy polymer (D) has the highest char yield of all the epoxy resins. (C) 2004 Elsevier Ltd. All rights reserved.
引用
收藏
页码:305 / 310
页数:6
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