A MECHANICAL FATIGUE DAMAGE EVOLUTION MODEL FOR PB-FREE SOLDER MATERIALS

被引：0

作者：

Ladani, Leila J. ^{[1
]}

Razmi, Jafar ^{[1
]}

机构：

[1] Utah State Univ, Dept Mech & Aerosp Engn, Logan, UT 84322 USA

来源：

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, VOL 13, PTS A AND B | 2009年

关键词：

Continuum damage mechanics solder; micro-electronics; cyclic fatigue; CONSTITUTIVE MODEL; 63SN37PB SOLDER; TIME;

D O I：

暂无

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

Evaluating state of damage in a ductile material as it experiences mechanical fatigue and cyclic loading poses much complexity and has been the subject of many researches. This study revisits the anisotropic damage model developed by Lemaitre (1992) and proposes to use his model combined with a micro-mechanics and mechanism based damage evolution model (Energy Partitioning Damage Evolution (EPDE)) and also a Unified Creep Plasticity-based model to predict the state of damage. The model is examined for pure shear and is applied to Pb-free solder materials. New anisotropic damage model exponents are generated using experimental data for Pb-free solder for both EPDE and UPC-based models and are compared with exponents generated previously under the assumption of isotropic and homogenous damage evolution.

引用

页码：603 / 609

页数：7