Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modules

被引:0
|
作者
Nivelle, Philippe [1 ,2 ]
Borgers, Tom [2 ]
Voroshazi, Eszter [2 ]
Poortmans, Jef [2 ]
D'Haen, Jan [1 ]
De Ceuninck, Ward [2 ]
Daenen, Michael [1 ,2 ]
机构
[1] Hassell Univ, Martelarenlaan 42, B-3500 Hasselt, Belgium
[2] IMEC, Kapeldreef 75, B-3001 Heverlee, Belgium
来源
2018 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) | 2018年
关键词
Adhesion; Encapsulant; Reliability; Peel test; Photovoltaic modules (PV);
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Encapsulants are known to have a large impact on the reliability of PV modules. Use of new materials such as low temperature solder can have an impact on how the encapsulant behaves in a module throughout its lifetime. A novel test methodology is used in this work to measure the adhesion strength between the encapsulant and its interfaces. The methodology is applied to both plated as screen printed metallization, low temperature SnBiAg solder and thermally evaporated Ag. The first steps in determining the underlying physical phenomena are studied experimentally for these interfaces as they can provide input for reliability models.
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页数:6
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