Metal-armouring for shock protection of MEMS

被引:27
作者
Delahunty, A. K. [1 ]
Pike, W. T. [1 ]
机构
[1] Univ London Imperial Coll Sci Technol & Med, Opt & Semicond Devices Grp, London SW7 2AZ, England
关键词
MEMS; Shock protection; Metal-armour; Solder; CONTACT; SENSORS;
D O I
10.1016/j.sna.2013.11.008
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper demonstrates a novel concept for the shock protection of MEMS suspensions: solder is incorporated within the sidewalls of the suspension to produce protective metal armouring. This provides solder-solder contact at the extremes of the suspension travel, greatly increasing the shock resistance. Model suspension systems were fabricated using deep reactive ion etching (DRIE) and shock tested in a drop-test rig at acceleration levels up to 6000 x g. The solder armour proved to absorb 90% of the collision kinetic energy and double the shock resistance of the MEMS suspension. (C) 2013 Published by Elsevier B.V.
引用
收藏
页码:36 / 43
页数:8
相关论文
共 31 条
[1]  
Ayre R S, 2002, SHOCK VIBRATION HDB
[2]  
Brakke K., 2007, SURFACE EVOLVER DOCU
[3]   Strap-down microelectromechanical (MEMS) sensors for high-G munition applications [J].
Brown, TG ;
Davis, B ;
Hepner, D ;
Faust, J ;
Myers, C ;
Muller, P ;
Harkins, T ;
Hollis, M ;
Miller, C ;
Placzankis, B .
IEEE TRANSACTIONS ON MAGNETICS, 2001, 37 (01) :336-342
[4]   CONDUCTANCE CONSIDERATIONS IN THE REACTIVE ION ETCHING OF HIGH ASPECT RATIO FEATURES [J].
COBURN, JW ;
WINTERS, HF .
APPLIED PHYSICS LETTERS, 1989, 55 (26) :2730-2732
[5]  
Delahunty A, 2013, PROC IEEE MICR ELECT, P689, DOI 10.1109/MEMSYS.2013.6474336
[6]   Micropump technology and applications [J].
Hartley, FT .
ELECTRONICS AND STRUCTURES FOR MEMS, 1999, 3891 :403-409
[7]   Shock protection of penetrator-based instrumentation via a sublimation approach [J].
Hopf, T. ;
Kumar, S. ;
Karl, W. J. ;
Pike, W. T. .
ADVANCES IN SPACE RESEARCH, 2010, 45 (03) :460-467
[8]  
Hutchings I.M., 2001, J PHYS D, V12
[9]  
Ikuta K., 1992, Proceedings. IEEE Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots(Cat. No.92CH3093-2), P232, DOI 10.1109/MEMSYS.1992.187723
[10]  
Jing-en L., 2005, EL PACK TECHN C 2005