Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes

被引：58

作者：

Chang, Y. W. ^{[1
]}

Liang, S. W. ^{[1
]}

Chen, Chih ^{[1
]}

机构：

[1] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 30050, Taiwan

来源：

APPLIED PHYSICS LETTERS | 2006年 / 89卷 / 03期

关键词：

D O I：

10.1063/1.2226989

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Kelvin bump probes were fabricated in flip-chip solder joints, and they were employed to monitor the void formation during electromigration. We found that voids started to form at approximately 5% of the failure time under 0.8 A at 150 degrees C, and the bump resistance increased only 0.02 m Omega in the initial stage of void formation. Three-dimensional simulation was performed to examine the increase in bump resistance at different stages of void formation, and it fitted the experimental results quite well. This technique provides a systematic way for investigating the void formation during electromigration. (c) 2006 American Institute of Physics.

引用

页数：3

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