Introduction of high oxygen concentrations into silicon wafers by high-temperature diffusion

被引:31
作者
Casse, G
Glaser, M
Lemeilleur, F
Ruzin, A
Wegrzecki, M
机构
[1] Univ Liverpool, Dept Phys, Oliver Lodge Lab, Liverpool L69 7ZE, Merseyside, England
[2] CERN, Div EP, CH-1211 Geneva 23, Switzerland
[3] Inst Electron Technol, PL-02668 Warsaw, Poland
关键词
semiconductor detector; silicon; radiation hardness;
D O I
10.1016/S0168-9002(99)00869-4
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
The tolerance of silicon detectors to hadron irradiation can be improved by the introduction of a high concentration of oxygen into the starting material. High-resistivity Floating-Zone (FZ) silicon is required for detectors used in particle physics applications. A significantly high oxygen concentration( > 10(17) atoms cm(-3)) cannot readily be achieved during the FZ silicon refinement. The diffusion of oxygen at elevated temperatures from a SiO2 layer grown on both sides of a silicon wafer is a simple and effective technique to achieve high and uniform concentrations of oxygen throughout the bulk of a 300 mu m thick silicon wafer. (C) 1999 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:429 / 432
页数:4
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