Evaluation of SiO2 films and SiO2/Si interfaces by graded etching

被引:5
作者
Muraji, Y
Yoshikawa, K
Nakamura, M
Nakagawa, Y
机构
[1] Toray Res Ctr Ltd, Otsu, Shiga 5208567, Japan
[2] Chiba Univ, Dept Elect & Mech Engn, Inage Ku, Chiba 2638522, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 2002年 / 41卷 / 2A期
关键词
silicon dioxide; graded etching; chemical etching; atomic force microscopy (AFM); roughness; ellipsometry; X-ray photoelectron spectroscopy (XPS); transition layer;
D O I
10.1143/JJAP.41.805
中图分类号
O59 [应用物理学];
学科分类号
摘要
We have established a new preparation method for the evaluation of SiO2 films. The method. graded etching. a good replacement of conventional step etching. enables us to analyze the SiO2 films and the SiO2/Si interfaces in detail with much less effort. Three kinds of SiO2 films (HCl, dry and wet oxides) have been evaluated after graded etching. Atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS) results revealed the presence of a SiOx (0 < x < 2) rich transition layer near the SiO2/Si inter-faces, the amount of which differs among the three kinds of oxides, AFM images also indicated that the SiO2 films were etched spottily at the beginning of etching. which results in different roughnesses of the etched surfaces for the three kinds of oxides.
引用
收藏
页码:805 / 809
页数:5
相关论文
共 9 条
  • [1] IMPACT IONIZATION, TRAP CREATION, DEGRADATION, AND BREAKDOWN IN SILICON DIOXIDE FILMS ON SILICON
    DIMARIA, DJ
    CARTIER, E
    ARNOLD, D
    [J]. JOURNAL OF APPLIED PHYSICS, 1993, 73 (07) : 3367 - 3384
  • [2] FANG SJ, 1996, J ELECTROCHEM SOC, V143, P329
  • [3] FANG SJ, 1996, J ELECTROCHEM SOC, V143, P338
  • [4] SIO2/SI INTERFACE STRUCTURES AND RELIABILITY CHARACTERISTICS
    HASEGAWA, E
    ISHITANI, A
    AKIMOTO, K
    TSUKIJI, M
    OHTA, N
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (01) : 273 - 282
  • [5] EFFECT OF FINAL ANNEALING ON HOT-ELECTRON-INDUCED MOSFET DEGRADATION
    HSU, FC
    HUI, J
    CHIU, KY
    [J]. IEEE ELECTRON DEVICE LETTERS, 1985, 6 (07) : 369 - 371
  • [6] Radical oxygen (O*) process for highly-reliable SiO2 with higher film-density and smoother SiO2/Si interface
    Nagamine, M
    Itoh, H
    Satake, H
    Toriumi, A
    [J]. INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST, 1998, : 593 - 596
  • [7] ELECTROCHEMICAL CHARGING OF THERMAL SIO2 FILMS BY INJECTED ELECTRON CURRENTS
    NICOLLIA.EH
    BERGLUND, CN
    SCHMIDT, PF
    ANDREWS, JM
    [J]. JOURNAL OF APPLIED PHYSICS, 1971, 42 (13) : 5654 - &
  • [8] RASRAS M, 2000, IEDM
  • [9] CMOS devices below 0.1μm:: How high will performance go?
    Taur, Y
    Nowak, EJ
    [J]. INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST, 1997, : 215 - 218