Conductive polymer composites with segregated structures

被引:685
作者
Pang, Huan
Xu, Ling
Yan, Ding-Xiang [1 ]
Li, Zhong-Ming
机构
[1] Sichuan Univ, Coll Polymer Sci & Engn, Chengdu 610065, Peoples R China
基金
中国国家自然科学基金;
关键词
Segregated conductive polymer composites; Percolation behaviors; Mechanical properties; Sensing properties; Thermoelectric properties; Electromagnetic interference shielding properties; MOLECULAR-WEIGHT POLYETHYLENE; POSITIVE TEMPERATURE-COEFFICIENT; GRAPHENE OXIDE/POLYMER COMPOSITES; CARBON NANOTUBE COMPOSITES; LOW PERCOLATION-THRESHOLD; ELECTRICAL-CONDUCTIVITY; PARTICLE-SIZE; SELECTIVE LOCALIZATION; MECHANICAL-BEHAVIOR; THERMOELECTRIC BEHAVIOR;
D O I
10.1016/j.progpolymsci.2014.07.007
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Conductive polymer composites (CPCs) have generated significant academic and industrial interest for several decades. Unfortunately, ordinary CPCs with random conductive networks generally require high conductive filler loadings at the insulator/conductor transition, requiring complex processing and exhibiting inferior mechanical properties and low economic affordability. Segregated CPC (s-CPC) contains conductive fillers that are segregated in the perimeters of the polymeric granules instead of being randomly distributed throughout the bulk CPC material; these materials are overwhelmingly superior compared to normal CPCs. For example, the s-CPC materials have an ultralow percolation concentration (0.005-0.1 vol%), superior electrical conductivity (up to 10(6) S/m), and reasonable electromagnetic interference (EMI) shielding effectiveness (above 20 dB) at low filler loadings. Therefore, considerable progress has been achieved with s-CPCs, including high-performance anti-static, EMI shielding and sensing materials. Currently, however, few systematic reviews summarizing these advances with s-CPCs are available. To understand and efficiently harness the abilities of s-CPCs, we attempted to review the major advances available in the literature. This review begins with a concise and general background on the morphology and fabrication methods of s-CPCs. Next, we investigate the ultralow percolation behaviors of and the elements exerting a relevant influence (e.g., conductive filler type, host polymers, dispersion methods, etc.) on s-CPCs. Moreover, we also briefly discussed the latest advances in the mechanical, sensing, thermoelectric and EMI shielding properties of the s-CPCs. Finally, an overview of the current challenges and tasks of s-CPC materials is provided to guide the future development of these promising materials. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1908 / 1933
页数:26
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