GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises

被引：0

作者：

Kam, DG ^{[1
]}

Lee, H ^{[1
]}

Baek, S ^{[1
]}

Park, B ^{[1
]}

Kim, J ^{[1
]}

机构：

[1] Korea Adv Inst Sci & Technol, Dept Elect Engn & Comp Sci, Div Elect Engn, Terahertz Media & Syst Lab,Yusong Gu, Taejon 305701, South Korea

来源：

52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS | 2002年

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The concept of twisted pair on the cable interconnection can be readily applied to the differential lines on printed circuit board (PCB), which enables enhanced immunity against crosstalk and radiated emission. In this paper, twisted differential line (TDL) is implemented on PCB and fully characterized. First, the transmission characteristics of TDL including propagation constant and differential impedance are extracted by using 3D full-wave analysis. The potential of TDL for the transmission of over GHz signal and enhanced immunity against crosstalk and radiated emission is clearly shown. Second, the measurement results reconfirm TDL's capability as a good transmission line structure over several GHz. Also, it is modeled by a simple equivalent circuit, based on measurement results. Third, the enhanced immunity of TDL against crosstalk and radiated emission is clearly demonstrated by measurement results. TDL is compared with other transmission line structures showing its superiority. Finally, several ideas to improve TDL's performance are suggested and verified to be useful.

引用

页码：1058 / 1065

页数：2

共 9 条

[1]

Araneo R, 2001, 2001 IEEE EMC INTERNATIONAL SYMPOSIUM, VOLS 1 AND 2, P933, DOI 10.1109/ISEMC.2001.950512

[2] COMBINED DIFFERENTIAL AND COMMON-MODE SCATTERING PARAMETERS - THEORY AND SIMULATION [J].

BOCKELMAN, DE ;

EISENSTADT, WR .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1995, 43 (07) :1530-1539

[3]

BOCKELMAN DE, Patent No. 5389735

[4]

Collin R.E., Foundations for Microwave Engineering

[5] HIGH-SPEED VLSI INTERCONNECT MODELING BASED ON S-PARAMETER MEASUREMENTS [J].

EO, Y ;

EISENSTADT, WR .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (05) :555-562

[6]

Lee H, 2001, IEEE MTT-S, P889, DOI 10.1109/MWSYM.2001.967034

[7]

MUYSHONDT JE, Patent No. 5646368

[8] Embedded microstrip interconnection lines for gigahertz digital circuits [J].

Ryu, W ;

Baik, SH ;

Kim, H ;

Kim, J ;

Sung, MH ;

Kim, J .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (03) :495-503

[9] Design and verification of differential transmission lines [J].

Wu, H ;

Beyene, WT ;

Cheng, N ;

Huang, CC ;

Yuan, C .

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2001, :85-88

← 1 →