Improving Performance in Near-Threshold Circuits Using 3D IC Technology

被引:0
作者
Samal, Sandeep Kumar [1 ]
Li, Yang
Chen, GuoQing [2 ]
Lim, Sung Kyu [1 ]
机构
[1] Georgia Inst Technol, Sch ECE, Atlanta, GA 30332 USA
[2] Adv Micro Devices Inc, Beijing, Peoples R China
来源
2015 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) | 2015年
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D O I
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中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
Near-threshold computing (NTC) circuits have been shown to offer significant energy efficiency and power benefits, but with a huge performance penalty. In this paper, we demonstrate that 3D IC technology can overcome this limitation. We present a detailed case study with a 28nm commercial-grade core at 0.6V operation optimized with various 3D IC physical design methods. Our study shows that 3D IC NTC design outperforms 2D IC NTC by 29.5% in terms of performance at comparable energy. We also achieve almost 4X energy saving compared with the nominal voltage designs.
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页数:2
相关论文
共 2 条
  • [1] Fick D., 2012, 2012 IEEE International Solid-State Circuits Conference (ISSCC), P190, DOI 10.1109/ISSCC.2012.6176970
  • [2] Jung M., 2013, IEEE VEHICULAR TECHN, P1