Ultrasmall Integrated 3D Micro-Supercapacitors Solve Energy Storage for Miniature Devices

被引：161

作者：

Meng, Chuizhou ^{[1
,2
]}

Maeng, Jimin ^{[1
,3
,4
]}

John, Simon W. M. ^{[5
]}

Irazoqui, Pedro P. ^{[1
,2
]}

机构：

[1] Purdue Univ, Ctr Implantable Devices, W Lafayette, IN 47907 USA

[2] Purdue Univ, Weldon Sch Biomed Engn, W Lafayette, IN 47907 USA

[3] Purdue Univ, IDEAS Microwave Lab, W Lafayette, IN 47907 USA

[4] Purdue Univ, Dept Elect & Comp Engn, W Lafayette, IN 47907 USA

[5] Howard Hughes Med Inst, Jackson Lab, Bar Harbor, ME 04609 USA

来源：

ADVANCED ENERGY MATERIALS | 2014年 / 4卷 / 07期

关键词：

FABRICATION; FILMS; OXIDE;

D O I：

10.1002/aenm.201301269

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

A novel integrated 3D micro-supercapacitor is reported. A through-via bottom electrode technique is utilized for the first time for supercapacitor fabrication, and a highly miniaturized, flexible, and all-solid-state micro-supercapacitor with 3D integration capability is achieved. Module-wise compact integration of supercapacitors and their versatile powering applications are demonstrated. This device enables high-power energy storage in small-scale electronics. © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

引用

页数：7

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