Insulation Materials and Systems for Power Electronics Modules: A Review Identifying Challenges and Future Research Needs

被引:79
作者
Zhang, Boya [1 ]
Ghassemi, Mona [2 ]
Zhang, Yunxiao [3 ]
机构
[1] Xi An Jiao Tong Univ, Sch Elect Engn, State Key Lab Elect Insulat & Power Equipment, Xian 710049, Shaanxi, Peoples R China
[2] Virginia Tech, Dept Elect & Comp Engn, Blacksburg, VA 24061 USA
[3] Tsinghua Univ, Dept Elect Engn, State Key Lab Control & Simulat Power Syst & Gene, Beijing 100084, Peoples R China
基金
美国国家科学基金会;
关键词
Employee welfare; Insulation; Power electronics; Dielectrics; Dielectric liquids; Electric fields; Next generation networking; insulation degradation; electrical tree; silicone gel; high temperature; high frequency; high slew rate; wide bandgap; power electronics modules;
D O I
10.1109/TDEI.2020.009041
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This manuscript critically reviews recent research on electrical insulation materials and systems used in power electronics devices and focuses on electrical treeing in silicone gel, PD modeling, and mitigation methods. For mitigation methods, electric field grading techniques, such as 1) various geometrical techniques, and 2) applying nonlinear dielectrics are discussed. Alternatives for silicone gel, such as liquid dielectrics, are also highlighted. The drawbacks of reported research and technical gaps are identified. In particular, we show that the investigations carried out to date are in their infancy regarding the working conditions targeted for next-generation WBG power devices. This review will provide a useful framework and point of reference for future research.
引用
收藏
页码:290 / 302
页数:13
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