Reliability of Instant Bonding of Cu-Cu joints: Thermal Cycling and Electromigration Tests

被引：0
|
作者：
Shie, Kai-Cheng [1 ]
Hsu, Po-Ning [1 ]
Li, Yu-Jin [1 ]
Tu, King-Ning [1 ,2 ]
Chen, Chih [1 ]
机构：
[1] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
[2] Natl Chiao Tung Univ, Int Coll Semicond Technol, Hsinchu, Taiwan
来源：
2020 15TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT 2020) | 2020年
关键词：
ANISOTROPIC GRAIN-GROWTH; INTERFACES;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：91 / 94
页数：4
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