The influence of adding different Sn-based solder coating into Sn-58Bi/Cu interface on the growth of intermetallic compound

被引：0
作者：
Wang, Fengjiang [1 ,2 ]
Li, Dongyang [1 ,2 ]
Huang, Ying
机构：
[1] Key Lab Adv Welding Technol Jiangsu Prov, Zhenjiang 212003, Peoples R China
[2] Jiangsu Univ Sci & Technol, Zhenjiang 212003, Peoples R China
来源：
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2017年
关键词：
IMC; coating; interface; Sn58Bi; inhibition; JOINT; INTERCONNECT; SEGREGATION; BISMUTH;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this study, the influence of adding Sn-0.7Cu, Sn-1.2Cu, Sn-3.0Ag-0.5Cu and Sn-4.0Ag-0.5Cu coating into Sn-58Bi/Cu interface was investigated during thermal aging by scanning electron microscopy with Energy Dispersive X-ray. And the coatings of the Sn-based solder on the Cu were made by using hot-dip method. The result showed the Sn-based coating on the Cu was effective at suppressing the IMCs' growth during aging process. The change of the total IMCs' thickness was analyzed by plotting the mean thickness versus the aging time. The experimental results confirmed that adding Sn-Ag-Cu solder coating into the interface had a better effect on the inhibition of the IMC than Sn-Cu solder coating. Adding Sn-based solder coating would lead the decrease of channels which resulted in the inhibition of IMC at Sn-58Bi/Cu interface.
引用
收藏
页码：266 / 270
页数：5
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