Effect of Annealing on Mechanical Properties and Nanoscale Lamellar Structure in Co-Cu Alloy

被引:5
作者
Yuasa, Motohiro [1 ]
Nakano, Hiromi [2 ]
Nakamoto, Yoshiaki [1 ]
Mabuchi, Mamoru [1 ]
机构
[1] Kyoto Univ, Grad Sch Energy Sci, Dept Energy Sci & Technol, Kyoto 6068501, Japan
[2] Ryukoku Univ, Fac Sci & Technol, Electron Microscope Lab, Otsu 5202194, Japan
关键词
cobalt; nanoscale lamellar structure; hardness; activation volume; microstructure-property relation; STRAIN-RATE SENSITIVITY; NANOCRYSTALLINE METALS; ULTRAHIGH-STRENGTH; TWIN BOUNDARIES; GRAIN-SIZE; DEFORMATION; COPPER; DUCTILITY; HARDNESS; COBALT;
D O I
10.2320/matertrans.MRA2008367
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
An electrodeposited Co-Cu alloy with a nanoscale lamellar structure was annealed at 673-973 K. The effects of annealing on the mechanical properties and the microstructures of the alloy such as the lamellar area ratio and the lamellar spacing were investigated. The Young's modulus of the Co-Cu alloy increased by annealing. This is mainly due to a decrease in the lamellar area ratio. The as-deposited specimens exhibited a low value of the activation volume for plastic deformation; however, the activation volume was increased by annealing. This appears to be related to an increase in lamellar spacing caused by annealing. The origins of the lamellar spacing dependence of the activation volume are discussed from the viewpoint of the emission of dislocations from the lamellar boundary.
引用
收藏
页码:570 / 578
页数:9
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