Solderability of Sn-9Zn-0.5Ag-1In lead-free solder on Cu substrate Part 1. Thermal properties, microstructure, corrosion and oxidation resistance

被引：41
作者：
Chang, Tao-Chih
Wang, Jian-Wen
Wang, Moo-Chin
Hon, Min-Hsiung
机构：
[1] Natl Kaohsiung Univ Appl Sci, Dept Mech Engn, Kaohsiung 80782, Taiwan
[2] Da Yeh Univ, Changhua, Taiwan
[3] Chung Hwa Coll Med Technol, Dept Environm & Safety Engn, Tainan 71703, Taiwan
[4] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
来源：
JOURNAL OF ALLOYS AND COMPOUNDS | 2006年 / 422卷 / 1-2期
关键词：
lead-free solder; heat of fusion; corrosion resistance; oxidation;
D O I：
10.1016/j.jallcom.2005.09.094
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
The thermal properties, microstructure corrosion and oxidation resistance of the Sn-9Zn-0.5Ag-1In lead-free solder have been investigated by differential scanning calorimetry, X-ray diffractometry, scanning electron microscopy, energy dispersive spectrometry, potentiostat and thermogravimetry. The Sn-9Zn-0.5Ag-1In solder alloy has a near-eutectic composition, it melts at 187.6 degrees C and the heat of fusion is determined as 71.3 J/g. The Sn-9Zn-0.5Ag-1In solder alloy with a corrosion potential Of -1.09 V-SCE and a current density of 9.90 x 10(-2) A/cm(2), shows a better corrosion resistance than that of the Sn-9Zn solder alloy. From the thermogravimetry analysis, the weight gain ratio of the Sn-9Zn solder alloy appears a parabolic relationship at 150 degrees C. The initial oxidation behavior of the Sn-9Zn-0.5Ag and Sn-9Zn-0.5Ag-1In solder alloys also shows a parabolic relationship but the weight gain ratio of them appears a negative linear one after aging at 150 degrees C for 2.5 and 5 h, respectively. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码：239 / 243
页数：5
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