Upgrading Pb-free soldering technology (2) - Flow soldering

被引：0

作者：

Miyazaki, M

Nomura, S

Takei, T

Katayama, N

Tanaka, H

Akanuma, M

机构：

来源：

SECOND INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DESIGN AND INVERSE MANUFACTURING, PROCEEDINGS | 2001年

关键词：

D O I：

暂无

中图分类号：

X [环境科学、安全科学];

学科分类号：

08 ; 0830 ;

摘要：

In this study we have challenged to upgrading of wave soldering for Sn-Ag-Cu system lead free solder, especially under conventional soldering temperature of 523K. In order to improve solderability, of Sn-Ag-Cu solder, the solderability, test using practical wave soldering equipment and the wettability test has been conducted. As a result, it has become clear that the shape of wave former and wave width were the significant factors to get the good solderability, and therefore this wave soldering equipment shall be require to be more sophisticated and improvement. Moreover, it has become clear that the wettability of Sn-Ag-Cu solder rarely change or improved by the addition of almost element. From the point of view of wettability, it has been obvious that it is almost no problem on influence of impurities.

引用

页码：1076 / 1078

页数：3

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