Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds

被引：49

作者：

Ma, Z. L. ^{[1
]}

Xian, J. W. ^{[1
]}

Belyakov, S. A. ^{[1
]}

Gourlay, C. M. ^{[1
]}

机构：

[1] Imperial Coll London, Dept Mat, London SW7 2AZ, England

来源：

ACTA MATERIALIA | 2018年 / 150卷

基金：

英国工程与自然科学研究理事会;

关键词：

Intermetallics; EBSD; Orientation relationship; Nucleation; Twinning; SN-AG-CU; HETEROGENEOUS NUCLEATION; GRAIN-REFINEMENT; UNDERCOOLING BEHAVIOR; PHASE-STABILITY; FREE SOLDERS; CU6SN5; GROWTH; MICROSTRUCTURE; ALLOYS;

D O I：

10.1016/j.actamat.2018.02.047

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

beta Sn nucleation is a key step in the formation of microstructure in electronic solder joints. Here, the heterogeneous nucleation of beta Sn is studied in undercooled tin droplets spread on the facets of various intermetallic compounds (IMCs). Nucleation undercoolings are measured in solidifying droplets and are linked to orientation relationships (ORs) measured by electron backscatter diffraction (EBSD). Preferred ORs developed on all IMCs studied. For the more potent nucleants (alpha CoSn3, IrSn4, PtSn4, PdSn4) the ORs represent relatively simple atomic matches. ORs with lower potency nucleants (Cu6Sn5, Ag3Sn, Ni3Sn4) had more complex atomic matches that are explored based on matching of the closest packed atomic rows. beta Sn solidification twinning is shown to be more complex than has been reported previously: both nucleation on an IMC facet and cyclic twinning of that grain occurred in many droplets on Cu6Sn5, Ag3Sn, Ni3Sn4; in all twinned droplets the <100>(Sn) twinning axis occurred along a direction on the IMC with the lowest linear atomic disregistry; and interrelated cyclic twins formed consisting of up to five rings of cyclic twins all related by shared <100>(Sn) axes. (C) 2018 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：281 / 294

页数：14

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