Some mechanical properties of Sn-3.5 Ag eutectic alloy at different temperatures

被引：37
作者：
El-Bahay, MM [1 ]
El Mossalamy, ME [1 ]
Mahdy, M [1 ]
Bahgat, AA [1 ]
机构：
[1] Al Azhar Univ, Fac Sci, Dept Phys, Cairo 11884, Egypt
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2004年 / 15卷 / 08期
关键词：
D O I：
10.1023/B:JMSE.0000032586.62418.6c
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The eutectic alloy Sn-3.5wt% Ag has been examined as one of the lead-free solder alloys. Microhardness tests as a function of temperature were performed to calculate the effective activation energy of the solder alloy Sn-Ag and compared with the pure elements Sn and Ag. Various creep parameters such as, exponent n(tr) and the parameter beta in the transient creep stage and the values of the stress exponent n from the steady-state stage were calculated under different constant applied stresses at different working temperatures. The structure changes of the alloy were reported before and after creep test. (C) 2004 Kluwer Academic Publishers.
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页码：519 / 526
页数：8
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