Evaluation of Intrinsic Parameter Fluctuations on 45, 32 and 22nm Technology Node LP N-MOSFETs

被引:7
作者
Cheng, B. [1 ]
Roy, S. [1 ]
Brown, A. R. [1 ]
Millar, C. [1 ]
Asenov, A. [1 ]
机构
[1] Univ Glasgow, Dept Elect & Elect Engn, Glasgow G12 8QQ, Lanark, Scotland
来源
ESSDERC 2008: PROCEEDINGS OF THE 38TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE | 2008年
关键词
D O I
10.1109/ESSDERC.2008.4681695
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The quantitative evaluation of the impact of key sources of statistical variability (SV) are presented for LP nMOSFETs corresponding to 45nm, 32nm and 22nm technology generation transistors with bulk, thin body (TB) SOI and double gate (DG) device architectures respectively. The simulation results indicate that TBSOI and DG are not only resistant to random dopant induced variability, but also are more tolerant to line edge roughness induced variability. Even two technology generations ahead from their bulk counterparts, DG MOSFETs will still have 4 times less variability than bulk devices.
引用
收藏
页码:47 / 50
页数:4
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