Surface roughness prediction model for ceramic grinding

被引:0
作者
Agarwal, Sanjay [1 ]
Rao, P. Venkateswara [1 ]
机构
[1] Indian Inst Technol, Dept Mech Engn, New Delhi 110016, India
来源
MANUFACTURING ENGINEERING AND MATERIALS HANDLING, 2005 PTS A AND B | 2005年 / 16卷
关键词
analytical model; surface roughness; ceramic grinding; chip thickness;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Surface quality of workpiece during ceramic grinding is an ever-increasing concern in industries now-a-days. Every industry cares to produce products with supposedly better surface finish. The importance of the surface finish of a product depends upon its functional requirements. Since surface finish is governed by many factors and its experimental determination is laborious and time consuming. So the establishment of a model for the reliable prediction of surface roughness is still a key issue for ceramic grinding. In this study, a new analytical surface roughness model is developed on the basis of stochastic nature of the grinding process, governed mainly by the random geometry and the random distribution of cutting edges. The new model proposed for evaluating the surface roughness during ceramic grinding appears to yield results, which agree reasonably well with the experimental results. This model is found to be more accurate in predicting the surface roughness when compared to the existing model.
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收藏
页码:1237 / 1245
页数:9
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