Implementing high density, Cu/BCB thin film interconnect on glass substrates for a portable telecom application

被引：0

作者：

Deshpande, U

Chazen, D

Skinner, M

Theide, H

Begay, M

Stafford, J

Bonda, R

机构：

来源：

1997 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS | 1997年 / 3235卷

关键词：

Cu/BCB; thin film; flip chip; display;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

MicroModule Systems and Motorola have jointly developed a new high volume Cu/photo BCB glass substrate process that supports 40 micron pitch traces, and low cost flip chip assembly. The glass substrate technology was implemented on the 150 mm wafer line at MMS, and is slated for use in Motorola's Virtue Vue(TM) display device.

引用

页码：472 / 475

页数：4

共 9 条

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