On the delamination and crack formation in a thin wall fabricated using laser solid freeform fabrication process: An experimental-numerical investigation

被引:102
作者
Alimardani, Masoud [1 ]
Toyserkani, Ehsan [1 ]
Huissoon, Jan P. [1 ]
Paul, Christ P. [2 ]
机构
[1] Univ Waterloo, Dept Mech & Mechatron Engn, Waterloo, ON N2L 3G1, Canada
[2] Raja Ramanna Ctr Adv Technol, Laser Mat Proc Div, Indore, Madhya Pradesh, India
基金
加拿大自然科学与工程研究理事会;
关键词
Laser solid freeform fabrication; Delamination; Crack formation; Numerical modeling; Thermal stress field; STRESS-FIELDS; TEMPERATURE;
D O I
10.1016/j.optlaseng.2009.06.010
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Parts fabricated using laser solid freeform fabrication (LSFF) are subject to thermal stresses due to the layer-by-layer material deposition and the temperature distribution characteristic throughout the process domain. The thermal stress patterns and intensity contribute significantly to potential delamination and crack formation. in this paper, the temperature distribution and stress field induced during the multilayer LSFF process, and their correlation with delamination and crack formation are studied. This is performed by a numerical and experimental investigation in the fabrication of a thin wall of 304L stainless steel. For time-dependent predictions on the locations of maximum temperatures and thermal stresses and their patterns, a three-dimensional (3D) transient finite element model is employed to simulate the process, including the geometry of the deposited materials as well as coupled temperature and stress distributions across the process domain. The experimental results are used to verify the numerical results as well as to investigate the correlation between the numerical results and micro-crack formations across the fabricated parts. The experiments are conducted with the same process parameters used in the numerical analyses using a 1 kW Nd:YAG pulsed laser. The trend of numerical and experimental results reveals that by preheating the substrate prior to the fabrication process, it is possible to substantially reduce the micro-cracks formed across the part. To demonstrate the feasibility of preheating on the reduction of micro-cracks, several simulations and experiments are performed in which a crack-free result is obtained when the substrate is preheated to 800 K. For this case, 22% reduction in thermal stresses is obtained throughout the process domain. (C) 2009 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1160 / 1168
页数:9
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