Structure and properties of a low viscosity acrylate based flexible epoxy resin

被引:6
作者
Yang, Yuan [1 ]
Zhao, Yun-Feng [2 ]
Wang, Jian-Yue [2 ]
Zhao, Chuan [2 ]
Tong, Liu [2 ]
Liu, Xiao-Yan [2 ]
Zhang, Ji-Hua [2 ]
Zhan, Mao-Sheng [1 ]
机构
[1] Beihang Univ, Sch Mat Sci & Engn, Minist Educ, Key Lab Aerosp Mat & Performance, Beijing 100191, Peoples R China
[2] Aerosp Res Inst Mat & Proc Technol, Beijing 100076, Peoples R China
关键词
elastomers; mechanical properties; resins; thermosets; viscosity and viscoelasticity; INTERPENETRATING POLYMER NETWORKS; DAMPING PROPERTIES; CURE KINETICS; DIGLYCIDYL ETHER; COMPOSITES; NANOCOMPOSITES; SYSTEM; FIBER;
D O I
10.1002/app.42959
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
A series of low viscosity acrylate-based epoxy resin (AE)/glycol diglycidyl ether (GDE) systems were prepared. The effect of GDE and low molecular weight polyamide (LPA) content on the rheological behavior, phase structure, damping, and mechanical properties were studied by differential scanning calorimeter (DSC), viscometer, scanning electron microscopy (SEM), dynamic mechanical thermal analysis (DMTA), and electro mechanical machine. The viscosity of the uncured AE systems decreased significantly after the incorporation of GDE. The damping properties were found to decrease slightly with the increasing GDE and LPA content. The tensile strength of the cured AE/GDE samples enhanced significantly after the incorporation of GDE with at least 150% improvement for all the samples while it decreased slightly with increasing LPA content. The AE/GDE cured systems were intended for future use as structural damping materials. (c) 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016, 133, 42959.
引用
收藏
页数:11
相关论文
共 34 条
  • [1] New development of self-damping MWCNT composites
    Alnefaie, K. A.
    Aldousari, S. M.
    Khashaba, U. A.
    [J]. COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2013, 52 : 1 - 11
  • [2] Bing T., 2014, Z APPL POLYM SCI, P40614
  • [3] Preparation, damping and thermal properties of potassium titanate whiskers filled castor oil-based polyurethane/epoxy interpenetrating polymer network composites
    Chen, Shoubing
    Wang, Qihua
    Wang, Tingmei
    Pei, Xianqiang
    [J]. MATERIALS & DESIGN, 2011, 32 (02) : 803 - 807
  • [4] Enhancing damping properties of epoxy resins using silicone macromolecule intercalated montmorillonite clay
    Chen Yang
    Yao Dingyang
    Zou Huawei
    Liang Mei
    [J]. RSC ADVANCES, 2014, 4 (84) : 44750 - 44756
  • [5] Development of a novel toughener for epoxy resins
    Dai, Jia-Bin
    Kuan, Hsu-Chiang
    Du, Xu-Shen
    Dai, Shao-Cong
    Ma, Jun
    [J]. POLYMER INTERNATIONAL, 2009, 58 (07) : 838 - 845
  • [6] Cure kinetics, morphological and dynamic mechanical analysis of diglycidyl ether of bisphenol-A epoxy resin modified with hydroxyl terminated poly(ether ether ketone) containing pendent tertiary butyl groups
    Francis, Bejoy
    Rao, V. Lakshmana
    Poel, Geert Vanden
    Posada, Fabrice
    Groeninckx, Gabriel
    Ramaswamy, R.
    Thomas, Sabu
    [J]. POLYMER, 2006, 47 (15) : 5411 - 5419
  • [7] 'Good vibrations', the science and application of intrinsically damped composite materials
    Grant, ID
    Lowe, AT
    Thomas, S
    [J]. COMPOSITE STRUCTURES, 1997, 38 (1-4) : 581 - 587
  • [8] Preparation and damping properties of fly ash filled epoxy composites
    Gu, Jian
    Wu, Gaohui
    Zhang, Qiang
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2007, 452 (614-618): : 614 - 618
  • [9] Viscoelasticity and fracture toughness of blended epoxy resins containing two monomers with different molecular weights
    Haris, Andi
    Adachi, Tadaharu
    Araki, Wakako
    [J]. JOURNAL OF MATERIALS SCIENCE, 2008, 43 (09) : 3289 - 3295
  • [10] Effect of Alkyl Side Chain Length on Relaxation Behaviors in Poly(n-alkyl Acrylates) and Poly(n-alkyl Methacrylates)
    He, Xiaojun
    Wu, Jinrong
    Huang, Guangsu
    Wang, Xiaoan
    [J]. JOURNAL OF MACROMOLECULAR SCIENCE PART B-PHYSICS, 2011, 50 (01): : 188 - 200