Comparison of hydrothermal performance between plate fins and plate-pin fins subject to nanofluid-cooled corrugated miniature heat sinks

被引:55
作者
Khoshvaght-Aliabadi, M. [1 ]
Hassani, S. M. [2 ]
Mazloumi, S. H. [2 ]
机构
[1] Islamic Azad Univ, Shahrood Branch, Dept Chem Engn, Shahrood, Iran
[2] Ferdowsi Univ Mashhad, Dept Chem Engn, Fac Engn, Mashhad, Iran
关键词
Corrugated miniature heat sink; Corrugation shape; Nanofluid; Plate fin; Plate-pin fin; TRANSFER ENHANCEMENT; THERMAL PERFORMANCE; FLOW; OPTIMIZATION;
D O I
10.1016/j.microrel.2017.01.005
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Thermal and hydraulic performances of two types of fin, namely plate and plate-pin, in water-cooled corrugated miniature heat sinks (MHSs) having triangular, trapezoidal, and sinusoidal shapes are evaluated. In fact, the plate-pin fins are designed and constructed based on the plate fins. Experiments are performed on the fabricated corrugated MHSs in range of Reynolds number between 100 and 900. Temperature contours and velocity vectors are also studied numerically using a CFD approach. The numerical results are validated with recorded experimental data in the present and previous studies. In addition to water, the Al2O3/water nanofluid is also testes in the corrugated MHSs, as nanofluid-cooled corrugated MHSs. The obtained results show that the thermal performance of a corrugated MHS with plate-pin fins is better than that of a corrugated MHS with plate fins. Another obvious advantage of plate-pin fins is that designers can reduce the pressure drop (or pumping power) in the corrugated MHSs for the same heat dissipation. The maximum hydrothermal performance factor of 1.84 is detected for 0.3% nanofluid flow in the corrugated MHS with sinusoidal plate-pin fins. (C) 2017 Elsevier Ltd. All rights reserved.
引用
收藏
页码:84 / 96
页数:13
相关论文
共 30 条
[1]   Experimental investigation for sequential triangular double-layered microchannel heat sink with nanofluids [J].
Ahmed, Hamdi E. ;
Ahmed, M. I. ;
Seder, Islam M. F. ;
Salman, B. H. .
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER, 2016, 77 :104-115
[2]   Investigation on the CPU nanofluid cooling [J].
Al-Rashed, Mohsen H. ;
Dzido, Grzegorz ;
Korpys, Mateusz ;
Smolka, Jacek ;
Wojcik, Janusz .
MICROELECTRONICS RELIABILITY, 2016, 63 :159-165
[3]  
Ali H. M., 2016, INT J HEAT MASS TRAN
[4]   Thermal performance investigation of staggered and inline pin fin heat sinks using water based rutile and anatase TiO2 nanofluids [J].
Ali, Hafiz Muhammad ;
Arshad, Waqas .
ENERGY CONVERSION AND MANAGEMENT, 2015, 106 :793-803
[5]   Thermal performance and friction factor of a cylindrical microchannel heat sink cooled by Cu-water nanofluid [J].
Azizi, Zoha ;
Alamdari, A. ;
Malayeri, M. R. .
APPLIED THERMAL ENGINEERING, 2016, 99 :970-978
[6]   Electronic cooling using water flow in aluminum metal foam heat sink: Experimental and numerical approach [J].
Bayomy, A. M. ;
Saghir, M. Z. ;
Yousefi, T. .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2016, 109 :182-200
[7]   Purpose, potential and realization of chip-attached micro-pin fin heat sinks [J].
Conrad, M. ;
Diatlov, A. ;
De Doncker, R. W. .
MICROELECTRONICS RELIABILITY, 2015, 55 (9-10) :1992-1996
[8]   Thermal optimization of water heat sink for power converters with tight thermal constraints [J].
Cova, P. ;
Delmonte, N. ;
Giuliani, F. ;
Citterio, M. ;
Latorre, S. ;
Lazzaroni, M. ;
Lanza, A. .
MICROELECTRONICS RELIABILITY, 2013, 53 (9-11) :1760-1765
[9]   A comparison of the heat transfer performance and pressure drop of nanofluid-cooled heat sinks with different miniature pin fin configurations [J].
Duangthongsuk, Weerapun ;
Wongwises, Somchai .
EXPERIMENTAL THERMAL AND FLUID SCIENCE, 2015, 69 :111-118
[10]   An experimental study on the thermal and hydraulic performances of nanofluids flow in a miniature circular pin fin heat sink [J].
Duangthongsuk, Weerapun ;
Wongwises, Somchai .
EXPERIMENTAL THERMAL AND FLUID SCIENCE, 2015, 66 :28-35