Synthesis and cure behaviors of diglycidylether of bisphenol-S epoxy resins

被引:0
作者
Park, SJ
Jin, FL
Lee, JR
Shin, JS
机构
[1] Korea Res Inst Chem Technol, Adv Mat Div, Taejon 305600, South Korea
[2] Chungbuk Natl Univ, Dept Chem, Chonju 361763, Chungbuk, South Korea
关键词
bisphenol-S; epoxy resin; glass transition temperature; thermal stability; activation energy;
D O I
暂无
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
In this work, diglycidylether of bisphenol-S (DGEBS) epoxy resin was prepared by alkaline condensation of bisphenol-S (BPS) with epichlorohydrin (ECH) in the presence of NaOH catalyst. The structure of the synthesized DGEBS epoxy resin was confirmed by IR, NMR spectra, and elemental analysis. The curing reaction and glass transition temperature (T-g) of DGEBS epoxy resin cured with phthalic anhydride (PA) and tetrahydrophthalic anhydride (THPA) as curing agents were studied by dynamic differential scanning calorimetry (DSC). The thermal stability of the cured specimen was investigated by thermogravimetric analysis (TGA). As a result, the activation energy (E-a) of DGEBS/PA system was higher than that of DGEBS/THPA system, whereas T-g, initial decomposed temperature (IDT), and decomposition activation energy (E-i) of DGEBS/PA were lower than those of DGEBS/THPA. This was probably due to the fact that the crosslinking density of DGEBS/THPA was increased by ring strain of curing agent.
引用
收藏
页码:501 / 507
页数:7
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