Underfill selection methodology for fine pitch Cu/low-k FCBGA packages

被引：13

作者：

Ong, Xuefen ^{[1
,2
]}

Ho, Soon Wee ^{[2
]}

Ong, Yue Ying ^{[2
]}

Wai, Leong Ching ^{[2
]}

Vaidyanathan, Kripesh

Lim, Yeow Kheng ^{[1
]}

Yeo, David ^{[1
]}

Chan, Kai Chong ^{[1
]}

Tan, Juan Boon ^{[1
]}

Sohn, Dong Kyun ^{[1
]}

Hsia, Liang Choo ^{[1
]}

Chen, Zhong ^{[3
]}

机构：

[1] Chartered Semicond Mfg Ltd, Singapore 738406, Singapore

[2] Inst Microelect, Singapore 117685, Singapore

[3] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore

来源：

MICROELECTRONICS RELIABILITY | 2009年 / 49卷 / 02期

关键词：

CHIP; ADHESION;

D O I：

10.1016/j.microrel.2008.11.015

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A systematic underfill selection approach has been presented to characterize and identify suitable under-fill encapsulants for large size flip chip ball grid array (FCBGA) packages. In the selection scheme, a total of six evaluation, factors such as fracture toughness, coefficient of moisture expansion, flowability, delamination performance and filler settlement were considered. Driving stresses for package failure were also included as a factor of consideration, which clearly depends on the package size and geometry. Based on the approach adopted, underfill material that is suitable for 35 x 35 mm(2) packages with 15 mm die size and 45 x 45 mm2 packages with 21 mm die size was selected. Target value for underfill properties has also been revised. (C) 2008 Elsevier Ltd. All rights reserved.

引用

页码：150 / 162

页数：13

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