Curing properties of an epoxy resin containing biphenyl structure

被引：0

作者：

Zhang, CL

Na, H ^{[1
]}

Mu, JX

Yu, WZ

Fu, TZ

Zhang, XG

Li, ZC

Wu, ZW

机构：

[1] Jilin Univ, Alan G MacDiarmid Inst, Changchun 130021, Peoples R China

[2] Jilin Univ, Coll Chem, Changchun 130021, Peoples R China

来源：

CHEMICAL JOURNAL OF CHINESE UNIVERSITIES-CHINESE | 2004年 / 25卷 / 09期

关键词：

biphenyl; epoxy resin; moisture absorption;

D O I：

暂无

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

A novel epoxy resin with biphenyl rings was synthesized with tetramethylbiphenol. In order to study the heat resistance and moisture absorption of this epoxy resin, two curing agents (DDM and DDS) were used. Compared to the bisphenol A epoxy resin, this novel epoxy resin has better heat resistance and its moisture resistance is improved, guite a lot also.

引用

页码：1756 / 1758

页数：3

共 9 条

[1] HSUAN LC, 2002, POLYMER, V43, P2959
[2] Lü CL, 2001, CHEM J CHINESE U, V22, P1924
[3] SHI N, 2000, THERMOSETTING RESIN, V15, P30
[4] Thermal properties of phthalic anhydride- and phenolic resin-cured rigid rod epoxy resins
Su, WF
Lee, YC
Pan, WP
[J]. THERMOCHIMICA ACTA, 2002, 392 : 395 - 398
[5] Su WFA, 1998, J APPL POLYM SCI, V70, P2163, DOI 10.1002/(SICI)1097-4628(19981212)70:11<2163::AID-APP9>3.0.CO
[6] 2-D
[7] Effects of chemical structure changes on curing reactions and thermal properties of cyanate ester-cured rigid-rod epoxy resins
Su, WFA
Chuang, CM
[J]. JOURNAL OF APPLIED POLYMER SCIENCE, 2002, 85 (11) : 2419 - 2422
[8] WU LY, 2000, THERMOSETTING RESIN, V15, P21
[9] ZHANG CL, 2002, THERMOSETTING RESIN, V17, P1

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