Influence of diamond graphitization on the microstructure and performance of micro-diamond modified C/C composites

被引：23

作者：

Chen, Lei ^{[1
]}

Yang, Xin ^{[1
,2
]}

Huang, Qizhong ^{[1
]}

Fang, Cunqian ^{[1
]}

Shi, Anhong ^{[1
]}

Liu, Ruirui ^{[1
]}

机构：

[1] Cent S Univ, State Key Lab Powder Met, Changsha 410083, Hunan, Peoples R China

[2] Aerosp Res Inst Mat & Proc Technol, Sci & Technol Adv Funct Composite Lab, Beijing 100076, Peoples R China

来源：

基金：

中国国家自然科学基金;

关键词：

C/C composites; Micro-diamond particles; Graphitization; Microstructure; Performance; GRAPHITE-LIKE STRUCTURES; THERMAL-CONDUCTIVITY; CARBON/CARBON COMPOSITES; STRESS GRAPHITIZATION; MECHANICAL-PROPERTIES; CARBON; TRANSFORMATION; REINFORCEMENT; NANOTUBES;

D O I：

10.1016/j.diamond.2019.04.003

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Micro-diamond modified C/C composites (C/C-D composites) were fabricated using pressureless infiltration (PI) and chemical vapor infiltration (CVI) methods. And the influence of diamond graphitization on the microstructure and performance of C/C-D composites were investigated. During further graphitization process of diamond particles (1600 degrees C), thicker graphite layer formed on diamond surface accompanied by volume expansion, which induced stress graphitization to surrounding PyC. Meanwhile, the graphite/PyC interface bonding strength improved significantly after diamond graphitization. Compared with the low strength retention rate of C/C composites (46.8%) after heat treated at 1600 degrees C, a high strength retention rate was achieved for C/C-D composites (87.1%) benefiting from the enhanced graphite/PyC interface bonding strength after diamond graphitization. And the thermal conductivity of the as-prepared C/C-D composites increased by 32.5% with the addition of diamond particles (9.97 wt%). It could be expected that C/C composites with optimal microstructure and excellent performances can be obtained by adjusting the content and graphitization degree of diamond particles in future work.

引用

页码：99 / 108

页数：10

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