Electrochemical Etching of Copper Foils for Graphene Preparation by CVD

被引:0
作者
Machac, P. [1 ]
Tichy, T. [1 ]
机构
[1] Univ Chem & Technol, Dept Solid State Engn, 5 Tech, Prague 16628 6, Czech Republic
来源
2018 12TH INTERNATIONAL CONFERENCE ON ADVANCED SEMICONDUCTOR DEVICES AND MICROSYSTEMS (ASDAM) | 2018年
关键词
MORPHOLOGY;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The contribution is focused to modification of Cu foils prior to graphene growth by the method of chemical vapour deposition, with the aim to prepare higher quality graphene. The Cu foils are chemically polished prior to the process in various chemical solutions. Influence of these modifications has principal meaning to graphene growth; single-layer graphene has been prepared.
引用
收藏
页码:69 / 72
页数:4
相关论文
共 50 条
[21]   Enhancing Surface Roughness and Tensile Strength of Electrodeposited Copper Foils by Composite Additives [J].
Wang, Shao Peng ;
Wei, Kun Xia ;
Wei, Wei ;
Du, Qing Bo ;
Alexandrov, Igor V. .
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2022, 219 (05)
[22]   Improvement of performance stability of electrolytic copper foils by bi-component additives [J].
Sun, Yue ;
Pan, Jianfeng ;
Liu, Lingling ;
Fang, Youtong ;
Han, Gaorong ;
Liu, Jiabin .
JOURNAL OF APPLIED ELECTROCHEMISTRY, 2022, 52 (08) :1219-1230
[23]   Impact of the in situ rise in hydrogen partial pressure on graphene shape evolution during CVD growth of graphene [J].
Gebeyehu, Zewdu M. ;
Arrighi, Alois ;
Costache, Marius V. ;
Sotomayor-Torres, Clivia M. ;
Esplandiu, Maria J. ;
Valenzuela, Sergio O. .
RSC ADVANCES, 2018, 8 (15) :8234-8239
[24]   Interactive Effects of Additives and Electrolyte Flow Rate on the Microstructure of Electrodeposited Copper Foils [J].
Lin, Chun-Cheng ;
Yen, Chih-Han ;
Lin, Sheng-Chi ;
Hu, Chi-Chang ;
Dow, Wei-Ping .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2017, 164 (13) :D810-D817
[25]   Nanoporous InGaN of high In composition prepared by KOH electrochemical etching [J].
Radzali, R. ;
Zainal, N. ;
Yam, F. K. ;
Hassan, Z. .
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2013, 16 (06) :2051-2057
[26]   Mechanism of ion etching polycrystalline copper and influence on surface morphology [J].
Yi Chenxi ;
Tian Yefei ;
Zhang Haotian ;
Hu Yue ;
Bao Mingdong .
CAILIAO GONGCHENG-JOURNAL OF MATERIALS ENGINEERING, 2023, 51 (12) :169-176
[27]   Effects of 2-aminothiazoline and benzotriazole on copper foil etching [J].
Jin, Lei ;
Li, Ke ;
Wang, Zhao-Yun .
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2025, 103 (03) :125-130
[28]   Local electrochemical investigation of copper patina [J].
Mennucci, M. M. ;
Sanchez-Moreno, M. ;
Aoki, I. V. ;
Bernard, M-C. ;
de Melo, H. G. ;
Joiret, S. ;
Vivier, Vincent .
JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2012, 16 (01) :109-116
[29]   Effect of Potassium Carbonate Additives on the Properties of Copper Foils Electroplated at High Current Density [J].
Woo, Tae-Gyu ;
Park, Il-Song .
KOREAN JOURNAL OF METALS AND MATERIALS, 2023, 61 (05) :347-354
[30]   Electrochemical Preparation of Ultrafine Zinc Powder [J].
Abbar, Ali H. ;
Rushdi, Salih A. ;
Al-Tameemi, Husham M. .
INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2017, 12 (08) :7075-7088