Warpage measurements of IC package during the IR-reflow process

被引：0

作者：

Chien, CH ^{[1
]}

Chiou, YT ^{[1
]}

Tsai, ML ^{[1
]}

Hung, TC ^{[1
]}

机构：

[1] Natl Sun Yat Sen Univ, Dept Mech Engn, Kaohsiung, Taiwan

来源：

PROCEEDINGS OF THE SEM IX INTERNATIONAL CONGRESS ON EXPERIMENTAL MECHANICS | 2000年

关键词：

D O I：

暂无

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

The main aim of this study is to extending the holographic interferometry technique to measure the warpage of IC packages under IR-reflow process, It is noted that both the warpage and the ambient temperature change can cause image fringes. Therefore an auxiliary sphere is used to identify the fringe numbers caused by the ambient temperature change during the experiment. The warpage measurement of a TSOP package is used as an example. It can be shown that the proposed method works.

引用

页码：631 / 633

页数：3

共 7 条

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