共 50 条
- [41] Si wafer surface cleaning using laser-induced shock wave: a new dry cleaning methodology SURFACE & COATINGS TECHNOLOGY, 2003, 169 : 178 - 180
- [42] Time-of-flight measurements of ejected particles during dry laser cleaning Applied Physics B, 2006, 84 : 517 - 521
- [43] Time-of-flight measurements of ejected particles during dry laser cleaning APPLIED PHYSICS B-LASERS AND OPTICS, 2006, 84 (03): : 517 - 521
- [44] Laser cleaning of the metallic thin films from silicon wafer surface with UV laser radiation ROMOPTO 2003: SEVENTH CONFERENCE ON OPTICS, 2004, 5581 : 443 - 446
- [45] Dry cleaning technology of silicon wafer with a line beam for semiconductor fabrication by KrF excimer laser JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2002, 41 (7A): : 4563 - 4570
- [47] Acoustic laser cleaning of silicon surfaces APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2007, 89 (01): : 109 - 113
- [48] Dynamics of particle ejection in dry laser cleaning HIGH-POWER LASER ABLATION VI, PTS 1 AND 2, 2006, 6261
- [50] Laser-induced dry cleaning in air - a new surface cleaning technology in lieu of carbon fluorochloride (CFC) solvents Lu, Yong-Feng, 1600, JJAP, Minato-ku, Japan (33):