Analysis of PCB Via for Signal Integrity Using ANOVA

被引：0

作者：

Zhou, Shilei ^{[1
]}

Guan, Yalin ^{[1
]}

Tang, Xinkun ^{[1
]}

机构：

[1] Commun Univ China, Inst Informat Engn, Beijing, Peoples R China

来源：

ADVANCED RESEARCH IN MATERIAL SCIENCE AND MECHANICAL ENGINEERING, PTS 1 AND 2 | 2014年 / 446-447卷

关键词：

Signal Integrity; Via; Design of Experiments; Orthogonal Array; ANOVA (ANalysis Of VAriance) and HFSS;

D O I：

10.4028/www.scientific.net/AMM.446-447.956

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

This paper based on ANOVA (ANalysis Of VAriance) presents an investigation in the design of signal via in multilayered printed circuit boards (PCB) technology from a signal integrity point of view. Using the concept of the orthogonal array (OA), different via's physical aspect ratios have been set in the analysis. The impacts of these parameters are investigated with the help for a full-wave electromagnetic simulation soft HFSS. This study demonstrates the factors which is the most influence on the signal integrity.

引用

页码：956 / 960

页数：5

共 9 条

[1]

[Anonymous], 1999, Springer Series in Statistics, DOI DOI 10.1007/978-1-4612-1478-6

[2]

[Anonymous], 2007, INT SIGN INT HDB

[3]

Chang RWY, 2007, EL PACKAG TECH CONF, P262

[4]

Cox D. R., 2000, The theory of design of experiments, V1st

[5]

del Castillo Enrique, 2007, PROCESS OPTIMIZATION

[6]

Phadke MS., 2008, QUALITY ENG USING RO

[7]

Salehuddin Fauziyah, INT J ENG TECHNOLOGY, V9

[8]

Shina Sammy G., 2002, PROFESSIONAL ENG SER

[9]

Taguchi G., 2004, Quality Engineering Handbook

← 1 →