The tensile impact properties of aged Sn-3Ag-0.5Cu/Cu solder joints

被引：11
作者：
Van Luong Nguyen [1 ]
Chung, Chin-Sung [2 ]
Kim, Ho-Kyung [3 ]
机构：
[1] Seoul Natl Univ Sci & Technol, Grad Sch NID Fus Technol, Seoul 139743, South Korea
[2] Flow Master Co, R&D Ctr, Seoul 150105, South Korea
[3] Seoul Natl Univ Sci & Technol, Dept Mech & Automot Engn, Seoul 139743, South Korea
来源：
MICROELECTRONICS RELIABILITY | 2015年 / 55卷 / 12期
关键词：
Thermal aging; Solder strength; Fracture energy; Impact toughness; Fracture toughness; BALL SHEAR TEST; STRAIN-RATE; INTERMETALLIC COMPOUNDS; MECHANICAL-PROPERTIES; FRACTURE-TOUGHNESS; PULL TESTS; CU; BEHAVIOR; SPEED; STRENGTH;
D O I：
10.1016/j.microrel.2015.10.002
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The present study aims to evaluate the effects of isothermal aging on the mechanical properties of solder joints. To achieve this objective, the tensile impact behavior of lead-free Sn-3Ag-0.5Cu solder ball joints aged at 373 K for times ranging from 24 h to 1000 h was investigated using an altered miniature Charpy impact-testing system. The experimental results showed that the tensile strength, the work-of-fracture and the fracture toughness of solder joints were found to decrease as the effective strain rate (or the loading speed) as well as the aging time increased due to a thicker IMC layer with a coarser nodule under thermal aging. In addition, the joint strength after isothermal aging under a tensile load was more sensitive to the strain rate than those in the shear loading mode. Specifically, equations representing the relationships among the effective stress, the strain rate and the aging time were established for the solder joints aged at 373 K in this study. Furthermore, the mode II fracture toughness values were less than the mode I fracture toughness for each aging time condition of the solder joints. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码：2808 / 2816
页数：9
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