Moisture effect on SiCp/6061 Al MMC: Dissolution of interfacial Al4C3

被引：113

作者：

Park, JK

Lucas, JP

机构：

[1] Materials Science and Mechanics, Michigan State University, East Lansing

来源：

SCRIPTA MATERIALIA | 1997年 / 37卷 / 04期

关键词：

D O I：

10.1016/S1359-6462(97)00133-4

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

[No abstract available]

引用

页码：511 / 516

页数：6

共 12 条

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