Three-Dimensional Solid-State Lithium-Ion Batteries Fabricated by Conformal Vapor-Phase Chemistry

被引:109
作者
Pearse, Alexander [1 ]
Schmitt, Thomas [1 ]
Sahadeo, Emily [2 ]
Stewart, David M. [1 ,3 ]
Kozen, Alexander [5 ]
Gerasopoulos, Konstantinos [4 ]
Talin, A. Alec [6 ]
Lee, Sang Bok [2 ]
Rubloff, Gary W. [1 ,3 ]
Gregorczyk, Keith E. [1 ]
机构
[1] Univ Maryland, Dept Mat Sci & Engn, College Pk, MD 20742 USA
[2] Univ Maryland, Dept Chem, College Pk, MD 20742 USA
[3] Univ Maryland, Inst Syst Res, College Pk, MD 20742 USA
[4] Johns Hopkins Univ, Appl Phys Lab, Res & Exploratory Dev Dept, Laurel, MD 20723 USA
[5] US Naval Res Lab, Amer Soc Engn Educ, 1818 N St NW,Suite 600, Washington, DC 20036 USA
[6] Sandia Natl Labs, Mat Phys Dept, MS9161,7011 East Ave, Livermore, CA 94550 USA
关键词
solid-state battery; three-dimensional solid-state battery; conformal battery; energy storage; three-dimensional energy storage; ATOMIC LAYER DEPOSITION; V2O5; THIN-FILMS; RECHARGEABLE BATTERIES; ENERGY-STORAGE; ELECTROLYTE; CATHODES; MICROBATTERIES;
D O I
10.1021/acsnano.7b08751
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Three-dimensional thin-film solid-state batteries (3D TSSB) were proposed by Long et al. in 2004 as a structure-based approach to simultaneously increase energy and power densities. Here, we report experimental realization of fully conformal 3D TSSBs, demonstrating the simultaneous power-and-energy benefits of 3D structuring. All active battery components-electrodes, solid electrolyte, and current collectors-were deposited by atomic layer deposition (ALD) onto standard CMOS processable silicon wafers microfabricated to form arrays of deep pores with aspect ratios up to approximately 10. The cells utilize an electrochemically prelithiated LiV2O5 cathode, a very thin (40-100 nm) Li2PO2N solid electrolyte, and a SnNx anode. The fabrication process occurs entirely at or below 250 degrees C, promising compatibility with a variety of substrates as well as integrated circuits. The multilayer battery structure enabled all-ALD solid-state cells to deliver 37/ mu Ah/cm(2).mu m (normalized to cathode thickness) with only 0.02% per-cycle capacity loss. Conformal fabrication of full cells over 3D substrates increased the areal discharge capacity by an order of magnitude while simulteneously improving power performance, a trend consistent with a finite element model. This work shows that the exceptional conformality of ALD, combined with conventional semiconductor fabrication methods, provides an avenue for the successful realization of long sought 3D TSSBs which provide power performance scaling in regimes inaccessible to planar form factor cells.
引用
收藏
页码:4286 / 4294
页数:9
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