Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

被引：30
作者：
Yang, Ming [1 ]
Ko, Yong-Ho [1 ,2 ]
Bang, Junghwan [1 ]
Kim, Taek-Soo [2 ]
Lee, Chang-Woo [1 ]
Zhang, Shuye [2 ]
Li, Mingyu [3 ]
机构：
[1] Korea Inst Ind Technol KITECH, Microjoining Ctr, 156 Gaetbeol Ro, Incheon 21999, South Korea
[2] Korea Adv Inst Sci & Technol, Dept Mech Engn, 291 Daehak Ro, Daejeon 34141, South Korea
[3] Harbin Inst Technol, Shenzhen Key Lab Adv Mat, Shenzhen Grad Sch, Shenzhen 518055, Peoples R China
来源：
JOURNAL OF ALLOYS AND COMPOUNDS | 2017年 / 701卷
关键词：
Lead-free solder; Low Ag content solder; Crystal orientation; Growth kinetics; Interfacial reaction; MOLTEN SNAGCU SOLDER; SN-AG; LAYER; STRENGTH; BEHAVIOR; CU3SN;
D O I：
10.1016/j.jallcom.2017.01.109
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
An effective method for inhibiting the growth of interfacial intermetallic compounds during solid-state aging has been proposed in this study. Pre-tinned Cu substrates containing oriented interfacial Cu6Sn5 grains were prepared and reacted with a low-Ag Pb-free solder. The results show that the initial oriented interfacial grains were retained after the subsequent reflow. In addition, the presence of the oriented grains accelerated their orientation concentration and significantly affected the ultimate orientation distribution range during solid-state aging. As a result, the growth of the interfacial intermetallic compounds was inhibited due to the slower diffusion of Sn species through the solder/substrate interface. (C) 2017 Elsevier B.V. All rights reserved.
引用
收藏
页码：533 / 541
页数：9
相关论文
共 34 条
  • [1] Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes
    Chen, Hao
    Tsai, Yi-Ling
    Chang, Yu-Ting
    Wu, Albert T.
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 671 : 100 - 108
  • [2] Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging
    Choi, S
    Bieler, TR
    Lucas, JP
    Subramanian, KN
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (11) : 1209 - 1215
  • [3] Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag Solder/Cu joints
    Deng, X
    Sidhu, RS
    Johnson, P
    Chawla, N
    [J]. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2005, 36A (01): : 55 - 64
  • [4] Feng D., 1987, METAL PHYS PHASE TRA, P166
  • [5] Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substrates
    Flanders, DR
    Jacobs, EG
    Pinizzotto, RF
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 1997, 26 (07) : 883 - 887
  • [6] Calculating the diffusivity of Cu and Sn in Cu3Sn intermetallic by molecular dynamics simulations
    Gao, Feng
    Qu, Jianmin
    [J]. MATERIALS LETTERS, 2012, 73 : 92 - 94
  • [7] Phase stability, phase transformations, and elastic properties of Cu6Sn5:: Ab initio calculations and experimental results
    Ghosh, G
    Asta, M
    [J]. JOURNAL OF MATERIALS RESEARCH, 2005, 20 (11) : 3102 - 3117
  • [8] Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate
    Gong, Jicheng
    Liu, Changqing
    Conway, Paul P.
    Silberschmidt, Vadim V.
    [J]. ACTA MATERIALIA, 2008, 56 (16) : 4291 - 4297
  • [9] Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate
    Gong, Jicheng
    Liu, Changqing
    Conway, Paul P.
    Silberschmidt, Vadim V.
    [J]. SCRIPTA MATERIALIA, 2009, 60 (05) : 333 - 335
  • [10] In Situ Formation of Ag Capping Layer for Preventing Oxidation in Copper Chemical Mechanical Polishing
    Kang, Min Cheol
    Kim, Yung Jun
    Kim, Jae Jeong
    [J]. ELECTROCHEMICAL AND SOLID STATE LETTERS, 2009, 12 (09) : H340 - H343
1234