A Full-Order Equivalent Circuit Approach for Transmission Lines in Printed Circuit Boards

被引：0

作者：

Xu, Xin ^{[1
]}

Thiel, Werner ^{[1
]}

Bracken, J. Eric ^{[1
]}

机构：

[1] ANSYS Inc, Canonsburg, PA USA

来源：

2015 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS) | 2015年

关键词：

equivalent circuit approximation; modal decomposition; printed circuit board; trace;

D O I：

暂无

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

We propose a unique derivation of an accurate and efficient equivalent circuit model for simulating transmission line structures with layer-wise homogenous/inhomogeneous substrates. The derivation is based on mode constraints that arise naturally from mode assumptions. The resulting equivalent circuit representation reflects the fact that the decomposed modes are coupled. To further improve the accuracy of the equivalent circuit approach, a full order representation of the equivalent circuit is proposed.

引用

页数：3

共 50 条

[21] EQUIVALENT-CIRCUIT APPROACH TO LONG MAGNETICALLY INSULATED TRANSMISSION-LINES
BERGERON, KD
JOURNAL OF APPLIED PHYSICS, 1977, 48 (07) : 3065 - 3069
[22] A Novel Equivalent Circuit for On Chip Transmission Lines Modeling
Zeng, Dajie
Wang, Hongrui
Yang, Dongxu
Zhang, Li
Wang, Yan
Yu, Zhiping
Zhang, Yaohui
IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE 2010, 2010,
[23] Equivalent Circuit Model of Transmission Lines Illuminated by HPM
Zhang, Mingwen
Ma, Chunguang
Song, Ruilong
Gao, Yuanci
Luo, Yong
2024 JOINT INTERNATIONAL VACUUM ELECTRONICS CONFERENCE AND INTERNATIONAL VACUUM ELECTRON SOURCES CONFERENCE, IVEC + IVESC 2024, 2024,
[24] Analysis of crosstalk of coupled transmission lines by inserting additional traces grounded with vias on printed circuit boards
Li, SL
Liu, Y
Song, ZH
Hu, HF
ASIA-PACIFIC CONFERENCE ON ENVIRONMENTAL ELECTROMAGNETICS, CEEM'2003, PROCEEDINGS, 2003, : 451 - 454
[25] ELECTRICAL DESIGN OF SIGNAL LINES FOR MULTILAYER PRINTED-CIRCUIT BOARDS
CHANG, CS
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1988, 32 (05) : 647 - 657
[26] DESIGN AND SCHEDULING OF FLEXIBLE ASSEMBLY LINES FOR PRINTED-CIRCUIT BOARDS
DESSOUKY, MM
ADIGA, S
PARK, K
INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH, 1995, 33 (03) : 757 - 775
[27] A New Approach for Microfabrication of Printed Circuit Boards with Ultrafine Traces
Mirvakili, Seyed M.
Broderick, Kurt
Langer, Robert S.
ACS APPLIED MATERIALS & INTERFACES, 2019, 11 (38) : 35376 - 35381
[28] An equivalent circuit for emi prediction in printed circuit boards featuring a straight-to-bent microstrip line coupling
Bernardi, P.
Cicchetti, R.
Pelosi, G.
Reatti, A.
Selleri, S.
Tatini, M.
Progress In Electromagnetics Research B, 2008, 5 (01): : 107 - 118
[29] A new approach to designing easily recyclable printed circuit boards
Dmitriy Khrustalev
Arman Tirzhanov
Anastassiya Khrustaleva
Marlen Mustafin
Azamat Yedrissov
Scientific Reports, 12 (1)
[30] Heat conduction in printed circuit boards: A mesoscale modeling approach
Nakayama, Wataru
2007 INTERNATIONAL CONFERENCE ON THERMAL ISSUES IN EMERGINGTECHNOLOGIES - THEORY AND APPLICATIONS, 2007, : 39 - 46

← 1 2 3 4 5 →