The creep properties of lead-free solder joints

This paper describes the creep behavior of three tin-rich solders that have become candidates for use in lead-free solder joints: Sn-3.5Ag, Sn-3Ag-0.50Cu, and Sn-0.7Cu. The three solders show the same general behavior when tested in thin Joints between copper and Ni/Au metallized pads at temperatures between 60degreesC and 130degreesC. Their steady-state creep rates are separated into two regimes with different stress exponents. The low-stress exponents range from similar to3-6, while the high-stress exponents are anomalously high (7-12). Strikingly, the high-stress exponent has a strong temperature dependence near room temperature, increasing significantly as the temperature drops from 95degreesC to 60degreesC. The anomalous creep behavior of the solders appears to be due to the dominant tin constituent. Research on creep in bulk samples of pure tin suggests that the anomalous temperature dependence of the stress exponent may show a change in the dominant mechanism of creep. Whatever its source, it has the consequence that conventional constitutive relations for steady-state creep must be used with caution in treating tin-rich solder Joints, and qualification tests that are intended to verify performance should be carefully designed.