Pulse plating of nickel: influence of electrochemical parameters and composition of electrolyte

被引:26
作者
Halmdienst, M.
Hansal, W. E. G.
Kattenhauser, G.
Kautek, W.
机构
[1] Happy Plating GmbH, A-2560 Bemdorf, Austria
[2] Univ Vienna, Dept Phys Chem, A-1090 Vienna, Austria
[3] Tyrolit Schleifmittelwerke Swarovski KG, A-6130 Swchaz, Austria
来源
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING | 2007年 / 85卷 / 01期
关键词
pulse plating; nickel; hardness; organic additives; SULFAMATE; ALLOYS; KINETICS;
D O I
10.1179/174591907X161964
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
In this paper, the influence of the electrochemical parameters and the composition of the electrolyte on the properties of the deposits in pulse plating of nickel will be discussed. The characteristics and the electrochemical behaviour of a nickel sulphamate bath with and without organic additives were derived from fundamental electrochemical experiments. Plating experiments using pulsed current for the deposition revealed the resulting layer properties. The addition of organic bath additives strongly influences the properties of the deposited nickel layers. While the hardness of the layers can be considerably improved by organic additives in the plating electrolyte, these additives can interfere with the freshly deposited nickel surface during the off-time of the pulse sequence.
引用
收藏
页码:22 / 26
页数:5
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