Influence of argon ion bombardment on the formation of intermetallic compounds in the nickel-aluminum system

The formation of Ni (x) Al (y) intermetallic compounds in two-layer (Ni/Al) structures (nickel films deposited on aluminum substrates in vacuum) under bombardment by Ar(+) ions has been studied experimentally. The method based on Rutherford backscattering of He(+) ions is used to demonstrate that argon ion bombardment causes the formation of intermetallic compounds in the near-surface layer. The thickness of the intermetallic layer formed in the near-surface region substantially exceeds the projective ion path. The composition and thickness of the intermetallic layer depend mainly on the implantation dose and the substrate temperature, rather than on the ion current density. In the intermetallic layer, the content of nickel increases with increasing temperature. It has been established that, in the absence of bombardment, intermetallic phases are not observed at temperatures lower than T = 400A degrees C and that, in the presence of bombardment, the Ni(3)Al intermetallic layer arises at a temperature of 320A degrees C.