Improving shear strength of Sn-3.0Ag-0.5Cu/Cu joints and suppressing intermetallic compounds layer growth by adding graphene nanosheets

被引：45

作者：

Huang, Yilong ^{[1
]}

Xiu, Ziyang ^{[1
]}

Wu, Gaohui ^{[1
]}

Tian, Yanhong ^{[1
]}

He, Peng ^{[1
]}

Gu, Xiaolong ^{[2
]}

Long, Weimin ^{[3
]}

机构：

[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China

[2] Zhejiang Met Res Inst Co Ltd, Zhejiang Prov Key Lab Soldering & Brazing Mat & T, Hangzhou 310030, Zhejiang, Peoples R China

[3] Zhengzhou Res Inst Mech Engn, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou 450001, Peoples R China

来源：

MATERIALS LETTERS | 2016年 / 169卷

关键词：

Graphene nanosheets (GNSs); Electronic materials; Composite materials; IMC; Isothermal aging; Shear strength; SN-AG-CU; SOLDER JOINTS; LEAD;

D O I：

10.1016/j.matlet.2016.01.125

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This study investigated the effects of adding 0.1 wt% of graphene nanosheets (GNSs) into Sn-3.0Ag-0.5Cu solder matrix on the growth of intermetallic compounds (IMC) layer with Cu substrates during isothermal aging at temperatures of 100, 125, 150 and 175 degrees C for up to 7 days. The results indicated that the GNSs could provide huge diffusion barrier for the diffusion of Sn and Cu atoms in solder matrix, and the activation energy for IMC layer growth was calculated as 46.20 and 59.72 kl/mol for Sn-3.0Ag-0.5Cu solder and Sn-3.0Ag-0.5Cu-0.1GNSs composite solder, respectively. Compared with Sn-3.0Ag-0.5Cu solder joints, the IMC layer morphology transformation from scallop-type to layer-type and the IMC layer growth for composite solder joints were suppressed. After aging 7 days at 175 degrees C, the shear strength of composite solder joints, whose IMC layer was comparatively thin, was 30% higher than that of Sn-3.0Ag-0.5Cu solder joints. (C) 2016 Elsevier B.V. All rights reserved.

引用

页码：262 / 264

页数：3

共 11 条

[1] Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications [J].

Anderson, Iver E. .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) :55-76

[2] Effect of graphene doping on microstructural and mechanical properties of Sn-8Zn-3Bi solder joints together with electromigration analysis [J].

Hu, Xiao ;

Chan, Y. C. ;

Zhang, Kaili ;

Yung, K. C. .

JOURNAL OF ALLOYS AND COMPOUNDS, 2013, 580 :162-171

[3] Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders [J].

Kumar, K. Mohan ;

Kripesh, V. ;

Tay, Andrew A. O. .

JOURNAL OF ALLOYS AND COMPOUNDS, 2008, 450 (1-2) :229-237

[4] Electronics without lead [J].

Li, Y ;

Moon, KS ;

Wong, CP .

SCIENCE, 2005, 308 (5727) :1419-1420

[5]

Liu XY, 2013, ELECTRON J DIFFER EQ

[6] Improving the performance of lead-free solder reinforced with multi-walled carbon narlotubes [J].

Nai, S. M. L. ;

Wei, J. ;

Gupta, M. .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 423 (1-2) :166-169

[7] Influence of TiO2 nanoparticles on IMC growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints during isothermal aging process [J].

Tang, Y. ;

Li, G. Y. ;

Chen, D. Q. ;

Pan, Y. C. .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2014, 25 (02) :981-991

[8] Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate [J].

Tsao, L. C. ;

Chu, C. P. ;

Peng, S. F. .

MICROELECTRONIC ENGINEERING, 2011, 88 (09) :2964-2969

[9] Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn-3.5Ag-0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging [J].

Tsao, L. C. .

JOURNAL OF ALLOYS AND COMPOUNDS, 2011, 509 (33) :8441-8448

[10] Evolution of nano-Ag3Sn particle formation on Cu-Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering [J].

Tsao, L. C. .

JOURNAL OF ALLOYS AND COMPOUNDS, 2011, 509 (05) :2326-2333

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