共 10 条
[2]
Fang Aiping, 2008, THESIS
[3]
Ghafouri-Shiraz H., 2003, DISTRIBUTED FEEDBACK
[4]
Heck M. J. R., 2010, P SPIE, V7606
[5]
Highly efficient vertical outgassing channels for low-temperature InP-to-silicon direct wafer bonding on the silicon-on-insulator substrate
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B,
2008, 26 (04)
:1560-1568
[6]
Liang D., 2010, NATURE PHOTONICS, V4
[7]
Uniformity study of wafer-scale InP-to-silicon hybrid integration
[J].
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,
2011, 103 (01)
:213-218
[9]
Srinivasan S., 2012, INT SEM LAS IN PRESS